Quote for MD8155HB With NSN 5962-01-188-7173 of Intel Corp (CAGE Code 34649)

Mfg Part Number: MD8155HB	NSN : 5962-01-188-7173
NIIN : 011887173	CAGE Code : 34649
Manufacturer: Intel Corp	Item Name : Microcircuit Memory
FSC : 5962 Microcircuits Electronic

Thank you for your interest in MD8155HB part of with NSN 5962-01-188-7173 having CAGE Code 34649 under FSC 5962 Microcircuits Electronic manufactured by Intel Corp. You have reached our RFQ page for MD8155HB part, and completing the form below will allow you to request a quote on this Intel Corp product for your comparisons. As you complete our offered form, we ask that you provide us with as much information regarding your needs as you can for the NSN part MD8155HB, so that we may best personalize a solution that is fit for you. 011887173 34649 5962 Microcircuits Electronic Microcircuit Memory

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NSN Information for Part Number MD8155HB with NSN 5962-01-188-7173, 5962011887173

NSN	FSC	NIIN	CLS	Hazmat	DEMIL	Cancelled NSN
5962-01-188-7173 Item Description: MICROCIRCUIT,MEMORY	5962	011887173	0	N	B
	CIIC	HCC	ESD	PMIC	Criticality	ENAC
	U		B	A	0
Part Number	ISC	RNVC	RNCC	HCC	MSDS	SADC
SM-A-959137	3	9	5

Characteristics Data of NSN 5962-01-188-7173, 5962011887173

MRC	Criteria	Characteristic
ADAQ	BODY LENGTH	50.2 MILLIMETERS MINIMUM AND 51.3 MILLIMETERS MAXIMUM"
ADAT	BODY WIDTH	14.8 MILLIMETERS MINIMUM AND 15.6 MILLIMETERS MAXIMUM"
ADAU	BODY HEIGHT	2.0 MILLIMETERS MINIMUM AND 2.6 MILLIMETERS MAXIMUM"
AEHX	MAXIMUM POWER DISSIPATION RATING	1.5 WATTS"
AFGA	OPERATING TEMP RANGE	-55.0/+125.0 DEG CELSIUS"
AFJQ	STORAGE TEMP RANGE	-65.0/+150.0 DEG CELSIUS"
AGAV	END ITEM IDENTIFICATION	5820-01-145-4902 MODEM,CABLE DRI"
CBBL	FEATURES PROVIDED	BURN IN, MIL-STD-883, CLASS B AND HERMETICALLY SEALED AND MONOLITHIC AND STATIC OPERATION AND ELECTROSTATIC SENSITIVE"
CQSJ	INCLOSURE MATERIAL	CERAMIC"
CQSZ	INCLOSURE CONFIGURATION	DUAL-IN-LINE"
CQWX	OUTPUT LOGIC FORM	METAL OXIDE-SEMICONDUCTOR LOGIC"
CQZP	INPUT CIRCUIT PATTERN	37 INPUT"
CRHL	UNABLE TO DECODE	UNABLE TO DECODE"
CSWJ	UNABLE TO DECODE	UNABLE TO DECODE"
CWSG	TERMINAL SURFACE TREATMENT	SOLDER"
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.0 VOLTS NOMINAL POWER SOURCE"
CZEQ	TIME RATING PER CHACTERISTIC	400.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 400.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT"
CZER	MEMORY DEVICE TYPE	RAM"
TTQY	TERMINAL TYPE AND QUANTITY	40 PRINTED CIRCUIT"
ADAQ	BODY LENGTH	50.2 MILLIMETERS MINIMUM AND 51.3 MILLIMETERS MAXIMUM"
ADAT	BODY WIDTH	14.8 MILLIMETERS MINIMUM AND 15.6 MILLIMETERS MAXIMUM"
ADAU	BODY HEIGHT	2.0 MILLIMETERS MINIMUM AND 2.6 MILLIMETERS MAXIMUM"
AEHX	MAXIMUM POWER DISSIPATION RATING	1.5 WATTS"
AFGA	OPERATING TEMP RANGE	-55.0/+125.0 DEG CELSIUS"
AFJQ	STORAGE TEMP RANGE	-65.0/+150.0 DEG CELSIUS"
AGAV	END ITEM IDENTIFICATION	5820-01-145-4902 MODEM,CABLE DRI"
CBBL	FEATURES PROVIDED	BURN IN, MIL-STD-883, CLASS B AND HERMETICALLY SEALED AND MONOLITHIC AND STATIC OPERATION AND ELECTROSTATIC SENSITIVE"
CQSJ	INCLOSURE MATERIAL	CERAMIC"
CQSZ	INCLOSURE CONFIGURATION	DUAL-IN-LINE"
CQWX	OUTPUT LOGIC FORM	METAL OXIDE-SEMICONDUCTOR LOGIC"
CQZP	INPUT CIRCUIT PATTERN	37 INPUT"
CRHL	UNABLE TO DECODE	UNABLE TO DECODE"
CSWJ	UNABLE TO DECODE	UNABLE TO DECODE"
CWSG	TERMINAL SURFACE TREATMENT	SOLDER"
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	5.0 VOLTS NOMINAL POWER SOURCE"
CZEQ	TIME RATING PER CHACTERISTIC	400.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 400.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT"
CZER	MEMORY DEVICE TYPE	RAM"
TTQY	TERMINAL TYPE AND QUANTITY	40 PRINTED CIRCUIT"