Quote for 100-590 With NSN 5962-01-101-3756 of Data Device Corporation (CAGE Code 34984)

Mfg Part Number: 100-590	Alternate P/N: 100590
NSN : 5962-01-101-3756	NIIN : 011013756
CAGE Code : 34984	Manufacturer: Data Device Corporation
Item Name : Microcircuit Memory	FSC : 5962 Microcircuits Electronic

Thank you for your interest in 100-590 part of with NSN 5962-01-101-3756 having CAGE Code 34984 under FSC 5962 Microcircuits Electronic manufactured by Data Device Corporation. You have reached our RFQ page for 100-590 part, and completing the form below will allow you to request a quote on this Data Device Corporation product for your comparisons. As you complete our offered form, we ask that you provide us with as much information regarding your needs as you can for the NSN part 100-590, so that we may best personalize a solution that is fit for you. 011013756 34984 5962 Microcircuits Electronic Microcircuit Memory

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NSN Information for Part Number 100-590 with NSN 5962-01-101-3756, 5962011013756

NSN	FSC	NIIN	CLS	Hazmat	DEMIL	Cancelled NSN
5962-01-101-3756 Item Description: MICROCIRCUIT,MEMORY	5962	011013756	0	N	B
	CIIC	HCC	ESD	PMIC	Criticality	ENAC
	U		B	A	0
Part Number	ISC	RNVC	RNCC	HCC	MSDS	SADC
TMS54050JDL	2	9	5

Characteristics Data of NSN 5962-01-101-3756, 5962011013756

MRC	Criteria	Characteristic
ADAQ	BODY LENGTH	0.920 INCHES MAXIMUM"
ADAT	BODY WIDTH	0.288 INCHES MAXIMUM"
ADAU	BODY HEIGHT	0.180 INCHES MAXIMUM"
AEHX	MAXIMUM POWER DISSIPATION RATING	420.0 MILLIWATTS"
AFGA	OPERATING TEMP RANGE	+0.0/+70.0 DEG CELSIUS"
AFJQ	STORAGE TEMP RANGE	-55.0/+150.0 DEG CELSIUS"
CBBL	FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND HIGH SPEED AND W/ENABLE"
CQSJ	INCLOSURE MATERIAL	CERAMIC AND GLASS"
CQSZ	INCLOSURE CONFIGURATION	DUAL-IN-LINE"
CQWX	OUTPUT LOGIC FORM	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC"
CQZP	INPUT CIRCUIT PATTERN	14 INPUT"
CWSG	TERMINAL SURFACE TREATMENT	SOLDER"
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	20.0 VOLTS MAXIMUM POWER SOURCE"
CZEQ	TIME RATING PER CHACTERISTIC	200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT"
CZER	MEMORY DEVICE TYPE	ROM"
CZZZ	MEMORY CAPACITY	UNKNOWN"
TTQY	TERMINAL TYPE AND QUANTITY	18 PRINTED CIRCUIT"
ADAQ	BODY LENGTH	0.920 INCHES MAXIMUM"
ADAT	BODY WIDTH	0.288 INCHES MAXIMUM"
ADAU	BODY HEIGHT	0.180 INCHES MAXIMUM"
AEHX	MAXIMUM POWER DISSIPATION RATING	420.0 MILLIWATTS"
AFGA	OPERATING TEMP RANGE	+0.0/+70.0 DEG CELSIUS"
AFJQ	STORAGE TEMP RANGE	-55.0/+150.0 DEG CELSIUS"
CBBL	FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND HIGH SPEED AND W/ENABLE"
CQSJ	INCLOSURE MATERIAL	CERAMIC AND GLASS"
CQSZ	INCLOSURE CONFIGURATION	DUAL-IN-LINE"
CQWX	OUTPUT LOGIC FORM	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC"
CQZP	INPUT CIRCUIT PATTERN	14 INPUT"
CWSG	TERMINAL SURFACE TREATMENT	SOLDER"
CZEN	VOLTAGE RATING AND TYPE PER CHARACTERISTIC	20.0 VOLTS MAXIMUM POWER SOURCE"
CZEQ	TIME RATING PER CHACTERISTIC	200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT"
CZER	MEMORY DEVICE TYPE	ROM"
CZZZ	MEMORY CAPACITY	UNKNOWN"
TTQY	TERMINAL TYPE AND QUANTITY	18 PRINTED CIRCUIT"